google.com, pub-8612160310098011, DIRECT, f08c47fec0942fa0

Industry coalition aims to make glass substrates the standard in chipmaking


The alliance brings together several key players, including German firm Manz AG, Taiwan’s Scientech for wet etching, Hyawei Optronics for AOI inspection, as well as Lincotec, STK Corporation, Skytech, and Group Up for sputtering and ABF lamination equipment. Several other component suppliers are also part of the coalition.

Read Entire Article

Comments Closed

Comments are closed.

Copyright © No More Traffic